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XCZU7EV-L2FBVB900E

900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7EV-L2FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 660
  • Description: 900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq? UltraScale+? MPSoC EV series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 204.A 0.72V power supply is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 0.742V.At least 0.698V can be supplied as a power source.A system on a chip benefits from having 900 terminations.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.Aside from that, this SoC processor is also equipped with some additional features that are present in ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU7EV-L2FBVB900E System On Chip (SoC) applications.

  • Networked sensors
  • Level
  • Automotive
  • Apple smart watch
  • Keyboard
  • Microprocessors
  • Measurement tools
  • AC drive control module
  • Vending machines
  • Robotics