All Products

View All >>

XCZU9CG-1FFVC900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU9CG-1FFVC900E
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 904
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

On this SoC, there is Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor.Manufacturer assigns package 900-BBGA, FCBGA to this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.The average operating temps for this SoC meaning should be 0°C~100°C TJ.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.Total I/Os on this SoC part are 204.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU9CG-1FFVC900E System On Chip (SoC) applications.

Networked sensors
POS Terminals
Temperature
Test and Measurement
Industrial automation devices
sequence controllers
Industrial sectors
Embedded systems
Multiprocessor system-on-chips (MPSoCs)
Servo drive control module