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XCZU9CG-L1FFVC900I

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU9CG-L1FFVC900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 882
  • Description: 900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Zynq? UltraScale+? MPSoC CG is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells and that is something to note.There is a state-of-the-art Bulk package that houses this SoC system on a chip.Total I/Os on this SoC part are 204.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.As long as it receives a power supply that is at least 0.698V, it should be able to function.As a result, there are 900 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU9CG-L1FFVC900I System On Chip (SoC) applications.

  • Transmitters
  • RISC-V
  • POS Terminals
  • Measurement tools
  • Microcontroller based SoC ( RISC-V, ARM)
  • ARM
  • Efficient hardware for training of neural networks
  • Industrial AC-DC
  • Industrial automation devices
  • POS Terminals