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XCZU9EG-3FFVC900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU9EG-3FFVC900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 671
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O(Kg)

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Details

Tags

Parameters
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2013
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 600MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


There are Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 204 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU9EG-3FFVC900E System On Chip (SoC) applications.

  • CNC control
  • Published Paper
  • Smart appliances
  • Body control module
  • Central alarm system
  • Communication interfaces ( I2C, SPI )
  • String inverter
  • Three phase UPS
  • ARM
  • Industrial automation devices