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  • XPC8255CVVIFBC

XPC8255CVVIFBC

PowerPC G2 Microprocessor MPC82xx Series PC8255 480-LBGA Exposed Pad


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-XPC8255CVVIFBC
  • Package: 480-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: 366
  • Description: PowerPC G2 Microprocessor MPC82xx Series PC8255 480-LBGA Exposed Pad (Kg)

Purchase & Inquiry

Transport

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Means of Payment

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RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Operating Temperature -40°C~105°C TA
Packaging Tray
Published 2002
Series MPC82xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC8255
Speed 200MHz
Core Processor PowerPC G2
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
RoHS Status ROHS3 Compliant

XPC8255CVVIFBC Overview


Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 480-LBGA Exposed Pad. High reliability is achieved using advanced packaging method Tray. There are 1 Core 32-Bit cores per bus width on the CPU. K-40°C~105°C TAw what the operating temperature is around -40°C~105°C TA. In the series MPC82xx, it is found. The CPU is powered by a PowerPC G2 core. There are DRAM, SDRAM RAM controllers on this CPU. The microprocessor features interfaces I2C, SCC, SMC, SPI, UART, USART for better service. In this CPU, I/O is set to 3.3V. To find variants of the microprocessor, try searching with PC8255. It is offered by suppliers as a package 480-TBGA (37.5x37.5).

XPC8255CVVIFBC Features


PowerPC G2 Core

XPC8255CVVIFBC Applications


There are a lot of NXP USA Inc. XPC8255CVVIFBC Microprocessor applications.

  • Smart instruments
  • Calculator
  • Smartphones-calling, video calling, texting, email
  • Refrigerators
  • Oscilloscopes
  • Communication-bluetooth, Wi-Fi, radio
  • Fire alarms
  • Industrial robot
  • Process control devices
  • Oil and gas