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XPC850DECZT66BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-XPC850DECZT66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 286
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Purchase & Inquiry

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Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DECZT66BU Overview


Packed in 256-BGA, the microprocessor is convenient for shipping overseas. High reliability is achieved using advanced packaging method Tray. Cores/Bus width is 1 Core 32-Bit. It is important to understand the operating temperature around -40°C~95°C TA. This is part of the MPC8xx series. The CPU contains DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. 3.3V is the CPU's I/O address. If you are looking for variants of the cpu microprocessor, try search with PC850.

XPC850DECZT66BU Features



XPC850DECZT66BU Applications


There are a lot of NXP USA Inc. XPC850DECZT66BU Microprocessor applications.

  • Playstation
  • Industrial control field
  • Glucose monitoring systems (for Type 1 Diabetes)
  • Accu-check
  • Pacemakers (used to control abnormal heart rhythm)
  • Information appliances (networking of household appliances)
  • Instrument control
  • Entertainment-radios, CD players, televisions
  • Instrumentation and process control field
  • Electromechanical control