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XPC850DEZT50BUR2

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-XPC850DEZT50BUR2
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 286
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tape & Reel (TR)
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DEZT50BUR2 Overview


The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Be aware of the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. Memory controllers for this CPU are DRAM. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with PC850.

XPC850DEZT50BUR2 Features



XPC850DEZT50BUR2 Applications


There are a lot of NXP USA Inc. XPC850DEZT50BUR2 Microprocessor applications.

  • Calculator
  • Digital set-top boxes
  • Dishwashers
  • Virtual reality VR robots
  • DDC control
  • Process control devices
  • Fire detection & safety devices
  • Xbox
  • Industrial control field
  • Laminators