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XPC850DEZT66BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Origchip NO: 568-XPC850DEZT66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 434
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Purchase & Inquiry

Transport

Purchase

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Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DEZT66BU Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Recognize operating temperatures around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. As far as I/O is concerned, this CPU runs at 3.3V. Using PC850 will help you find variants of the cpu microprocessor.

XPC850DEZT66BU Features



XPC850DEZT66BU Applications


There are a lot of NXP USA Inc. XPC850DEZT66BU Microprocessor applications.

  • Metering & measurement field
  • Kindle
  • Mice
  • Electromechanical control
  • Medical instruments
  • Fire alarms
  • Entertainment products
  • Printers
  • Removable disks
  • Measurement and control field