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  • XPC850VR66BU

XPC850VR66BU

32-bit Microprocessor 256-Pin 66MHz 3.3V


  • Manufacturer: Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Origchip NO: 318-XPC850VR66BU
  • Package: -
  • Datasheet: PDF
  • Stock: 504
  • Description: 32-bit Microprocessor 256-Pin 66MHz 3.3V (Kg)

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Details

Tags

Parameters
Surface Mount YES
Number of Pins 256
Packaging Bulk
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Frequency 66MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Halogen Free Not Halogen Free
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Number of Cores 1
Height Seated (Max) 2.35mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant
Lead Free Lead Free

XPC850VR66BU Overview


High reliability is achieved using advanced packaging method Bulk. I would rate this as a MICROPROCESSOR, RISC for the uPs/uCs/Peripheral ICs type. To date, there have been 256 terminations. Turning on and running the embedded microprocessor with a 3.3V voltage supply should be possible. There are 32 bits in its architecture. At 66MHz, the CPU operates. You can refer to the datasheets for the functions of 256 pins. With a maximum supply current of 3.465V, it has a maximum power consumption. The external data bus width of this CPU is 32. If the temperature is higher than 95°C, the microprocessor should not operate. 256 pins are injected into the part body. There is only 1 core in this processor.

XPC850VR66BU Features


32-Bit Structure
1-Core CPU

XPC850VR66BU Applications


There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) XPC850VR66BU Microprocessor applications.

  • Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
  • Entertainment products
  • Computers and laptops-video calling, email, blogging
  • Robotic prosthetic limbs
  • Safety -airbags, automatic braking system (ABS)
  • Laminators
  • Electromechanical control
  • Projectors
  • Light sensing & controlling devices
  • X-ray