English

All Products

View All >>
  • XPC855TZP66D4

XPC855TZP66D4

1.27mm 3.3V 32-bit Microprocessor 357-Pin 3.3V BGA


  • Manufacturer: Freescale Semiconductor, Inc. (NXP Semiconductors)
  • Origchip NO: 318-XPC855TZP66D4
  • Package: BGA
  • Datasheet: PDF
  • Stock: 612
  • Description: 1.27mm 3.3V 32-bit Microprocessor 357-Pin 3.3V BGA (Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case BGA
Surface Mount YES
Number of Pins 357
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 357
ECCN Code 5A991
Terminal Finish TIN LEAD
HTS Code 8542.31.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 357
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3.135V
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Clock Frequency 66MHz
Bit Size 32
Halogen Free Not Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Height Seated (Max) 2.05mm
Length 25mm
Width 25mm
RoHS Status RoHS Compliant

XPC855TZP66D4 Overview


Due to its BGA packaging, it is convenient to ship overseas. As far as the uPs/uCs/Peripheral ICs type is concerned, this is a MICROPROCESSOR, RISC. As a whole, there are 357 terminations. With a 3.3V voltage supply, the part should be turned on and run. There is a 32-Bit architecture in it. Please refer to the datasheets for 357 pins functions. Supply current is maximum at 3.465V. The embedded microprocessor is a typical Other Microprocessor ICs. An external data bus width of 32 is available on this CPU. Injecting pins into the embedded microprocessor body results in 357 pins. CPU microprocessors with clock frequencies of 66MHz operate. According to the datasheet, the embedded microprocessor requires 3.3V power supply.

XPC855TZP66D4 Features


32-Bit Structure

XPC855TZP66D4 Applications


There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) XPC855TZP66D4 Microprocessor applications.

  • Microwave ovens
  • 3D printers
  • Copiers
  • Equipment control
  • Magnetic resonance imaging (MRI)
  • Radio
  • Graphic terminals
  • Ipad
  • Instrument control
  • Mobile computers