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XRT75L03DIVTR-F

Telecom device3 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT75L03DIVTR-F
  • Package: 128-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 898
  • Description: Telecom device3 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 128-LQFP Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Part Status Discontinued
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 3
Current - Supply 480mA
RoHS Status RoHS Compliant

XRT75L03DIVTR-F Overview


Board space can be saved by using the 128-LQFP Exposed Pad package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.A Surface Mount mounting type is used.Telecommunications equipment consists of 3 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A temperature setting of -40°C~85°C ensures reliable performance.480mA is the supply current.

XRT75L03DIVTR-F Features


Available in the 128-LQFP Exposed Pad package

XRT75L03DIVTR-F Applications


There are a lot of MaxLinear, Inc. XRT75L03DIVTR-F Telecom applications.

  • Intelligent PBX
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Set-Top Box
  • Multichannel DS1 Test Equipment
  • ISDN Primary Rate Interface
  • DECT (Digital European Cordless Telephone) Base
  • Channel Banks
  • PCM channel bank
  • ISDN NT1/TA
  • T3 channelized access concentrators