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XRT75R06DIB-F

Telecom device6 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT75R06DIB-F
  • Package: 217-BBGA
  • Datasheet: PDF
  • Stock: 647
  • Description: Telecom device6 Circuits(Kg)

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6
Current - Supply 725mA
RoHS Status RoHS Compliant

XRT75R06DIB-F Overview


Saving board space is achieved with the 217-BBGA package.In order to pack telecommunications equipment, Tray is used.Mounting type Surface Mount is used.The telecom IC is composed of 6 circuits.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.

XRT75R06DIB-F Features


Available in the 217-BBGA package

XRT75R06DIB-F Applications


There are a lot of MaxLinear, Inc. XRT75R06DIB-F Telecom applications.

  • Fiber in the loop (FITL)
  • Digital cross connects (DSX-1)
  • SONET/SDH terminal
  • SDH/SONET multiplexers
  • Router
  • ISDN Primary Rate Interfaces (PRA)
  • E2 Rates PCM Line Interface
  • Digital Cross Connect Systems
  • Fiber In The Loop (FITL)
  • Multi-Line E1 Interface Cards