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XRT85L61IGTR-F

Telecom device1 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Origchip NO: 493-XRT85L61IGTR-F
  • Package: 28-TSSOP (0.173, 4.40mm Width)
  • Datasheet: PDF
  • Stock: 366
  • Description: Telecom device1 Circuits(Kg)

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Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 28-TSSOP (0.173, 4.40mm Width)
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Published 2004
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Voltage - Supply 3.14V~3.47V
Function BITS Clock Extractor
Interface E1, T1
Number of Circuits 1

XRT85L61IGTR-F Overview


To save board space, the 28-TSSOP (0.173, 4.40mm Width) package is used.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.An 1-circuit makes up this telecom IC .Providing 3.14V~3.47V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.

XRT85L61IGTR-F Features


Available in the 28-TSSOP (0.173, 4.40mm Width) package

XRT85L61IGTR-F Applications


There are a lot of MaxLinear, Inc. XRT85L61IGTR-F Telecom applications.

  • Short/Medium Loop
  • Cable modem
  • Central office (CO)
  • Fiber In The Loop (FITL)
  • Add/Drop multiplexers (ADMs)
  • ISDN terminal adapter
  • PBXs channel bank
  • Public switching systems
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Fractional T1/E1/J1