Products
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Texas Instruments |
8-SOIC (0.154, 3.90mm Width) Thermal Management Contains Lead
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389 |
8-SOIC (0.154, 3.90mm Width) |
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Texas Instruments |
48-WFQFN Exposed Pad Thermal Management 3.6V V7mm mmContains Lead
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543 |
48-WFQFN Exposed Pad |
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Renesas Electronics America Inc. |
8-VFDFN Exposed Pad Thermal Management
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667 |
8-VFDFN Exposed Pad |
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Texas Instruments |
8-SOIC (0.154, 3.90mm Width) Thermal Management Contains Lead
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718 |
8-SOIC (0.154, 3.90mm Width) |
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ON Semiconductor |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3.3V VLead Free
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694 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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ON Semiconductor |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mmLead Free
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702 |
16-SSOP (0.154, 3.90mm Width) |
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Microchip Technology |
8-VFDFN Exposed Pad Thermal Management
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163 |
8-VFDFN Exposed Pad |
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Maxim Integrated |
8-SOIC (0.154, 3.90mm Width) Thermal Management 5.5V V
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665 |
8-SOIC (0.154, 3.90mm Width) |
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Renesas Electronics America Inc. |
8-VFDFN Exposed Pad Thermal Management
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315 |
8-VFDFN Exposed Pad |
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Microchip Technology |
8-VFDFN Exposed Pad Thermal Management
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956 |
8-VFDFN Exposed Pad |
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Maxim Integrated |
24-SSOP (0.154, 3.90mm Width) Thermal Management
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138 |
24-SSOP (0.154, 3.90mm Width) |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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423 |
48-LQFP |
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Renesas Electronics America Inc. |
8-VFDFN Exposed Pad Thermal Management
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329 |
8-VFDFN Exposed Pad |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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348 |
48-LQFP |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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331 |
48-LQFP |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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488 |
48-LQFP |
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Microchip Technology |
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V8.74mm mm
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272 |
24-SSOP (0.154, 3.90mm Width) |
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Renesas Electronics America Inc. |
32-VFQFN Exposed Pad Thermal Management
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428 |
32-VFQFN Exposed Pad |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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730 |
48-LQFP |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
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103 |
8-WFDFN Exposed Pad |
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Maxim Integrated |
Thermal Management
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697 |
- |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
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685 |
8-WFDFN Exposed Pad |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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444 |
48-LQFP |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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381 |
48-LQFP |
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Maxim Integrated |
Thermal Management
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222 |
- |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
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555 |
48-LQFP |
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Rochester Electronics, LLC |
Thermal Management
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330 |
- |
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Nuvoton Technology Corporation of America |
48-LQFP Thermal Management Lead Free
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961 |
48-LQFP |
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Maxim Integrated |
8-WFDFN Exposed Pad Thermal Management 3.6V VLead Free
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975 |
8-WFDFN Exposed Pad |
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Microchip Technology |
8-TSSOP (0.173, 4.40mm Width) Thermal Management Lead Free
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302 |
8-TSSOP (0.173, 4.40mm Width) |
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