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Thermal Management

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Maxim Integrated
24-TSSOP (0.173, 4.40mm Width) Thermal Management Contains Lead
647
24-TSSOP (0.173, 4.40mm Width)
Microchip Technology
IC SENSOR THERMAL 3.0V 8TSSOP
609
8-TSSOP (0.173, 4.40mm Width)
Microchip Technology
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management 3.2mm mm
356
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Texas Instruments
8-SOIC (0.154, 3.90mm Width) Thermal Management 3.3V V4.9mm mmLead Free
176
8-SOIC (0.154, 3.90mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
692
24-TSSOP (0.173, 4.40mm Width)
Microchip Technology
20-VFQFN Exposed Pad Thermal Management 3.3V V4mm mmLead Free
636
20-VFQFN Exposed Pad
Maxim Integrated
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 5.5V V5mm mmLead Free
856
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Renesas Electronics America Inc.
8-WFDFN Exposed Pad Thermal Management
736
8-WFDFN Exposed Pad
Linear Technology/Analog Devices
20-WFQFN Exposed Pad Thermal Management
276
20-WFQFN Exposed Pad
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management Lead Free
121
16-SSOP (0.154, 3.90mm Width)
ON Semiconductor
16-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V4.9022mm mmLead Free
973
16-SSOP (0.154, 3.90mm Width)
Microchip Technology
8-WFDFN Exposed Pad Thermal Management
581
8-WFDFN Exposed Pad
Texas Instruments
8-SOIC (0.154, 3.90mm Width) Thermal Management 3.3V V4.9mm mmLead Free
868
8-SOIC (0.154, 3.90mm Width)
Integrated Device Technology (IDT)
Thermal Management 5mm mm
777
-
Integrated Device Technology (IDT)
Thermal Management 2mm mmLead Free
730
-
Integrated Device Technology (IDT)
DFN Thermal Management 2mm mmLead Free
963
DFN
Integrated Device Technology (IDT)
Thermal Management 3.6V V2mm mmLead Free
370
-
Integrated Device Technology (IDT)
DFN Thermal Management 2mm mmLead Free
490
DFN
Integrated Device Technology (IDT)
DFN Thermal Management 2mm mmLead Free
187
DFN
Rochester Electronics, LLC
TO-100-10 Metal Can Thermal Management
865
TO-100-10 Metal Can
Maxim Integrated
20-SSOP (0.209, 5.30mm Width) Thermal Management 7.2mm mm
829
20-SSOP (0.209, 5.30mm Width)
Maxim Integrated
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
951
16-SSOP (0.154, 3.90mm Width)
Maxim Integrated
8-TSSOP (0.173, 4.40mm Width) Thermal Management 3.3V V
441
8-TSSOP (0.173, 4.40mm Width)
Nuvoton Technology Corporation of America
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Thermal Management
752
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Microchip Technology
8-TSSOP (0.173, 4.40mm Width) Thermal Management 3.0988mm mm
679
8-TSSOP (0.173, 4.40mm Width)
Texas Instruments
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
926
24-TSSOP (0.173, 4.40mm Width)
Microchip Technology
8-UFDFN Exposed Pad Thermal Management
701
8-UFDFN Exposed Pad
ON Semiconductor
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.6V V8.65mm mmLead Free
245
24-SSOP (0.154, 3.90mm Width)
Microchip Technology
8-VFDFN Exposed Pad Thermal Management 3mm mm
152
8-VFDFN Exposed Pad
Microchip Technology
8-WFDFN Exposed Pad Thermal Management
666
8-WFDFN Exposed Pad