All Products
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Integrated Circuits (ICs)
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Connectors
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Discrete Semiconductors
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Capacitors
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Sensors
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- Board Mount Poser Supplies
-
RF/IF & RFID
- RF/IF & RFID
- Attenuators
- Balun
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- RF Misc ICs and Modules
- RF Mixers
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- RFI & EMI Contacts
- RFI & EMI Materials
- RFID Accessories
- RFID Antennas
- RFID Boards
- RFID ICs
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- RFID Tags
- Circuit Protection
- Crystals
- Inductors
- Filters
NXP USA Inc.(17569)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Width | Mounting Type | Operating Temperature | Technology | Current - Supply | Height Seated (Max) | HTS Code | Number of Functions | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Analog IC - Other Type | Applications | Supply Current-Max (Isup) | Adjustable Threshold | Telecom IC Type | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC33FS6514LAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS6520LAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33PF8100EPESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56 | 8mm | 56-VFQFN Exposed Pad | 8mm | Surface Mount, Wettable Flank | -40°C~105°C TA | 1mm | 1 | QUAD | NO LEAD | 5V | YES | 0.5mm | S-PQCC-N56 | 2.5V | 12 | 5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | YES | 2.5V~5.5V | |||||||||||||||||||||
| MC33PF8100ERESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | |||||||||||||||||||||||||||||||||||
| MC33FS6501CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33VR5500V2ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| TDA3683J/N2S,112 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tube | 2001 | Not For New Designs | Not Applicable | 23 | ROHS3 Compliant | 23-SIP Formed Leads | Through Hole | -40°C~85°C | CMOS | 300μA | ZIG-ZAG | 14.4V | TDA3683 | 23 | NO | 1.27mm | R-PZIP-T23 | Power Management Circuits | Not Qualified | 14.4V | Ignition Buffer, Regulator | 0.45mA | 9V~18V | |||||||||||||||||||||
| MWPR1024IZVHT | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tray | Active | 3 (168 Hours) | RF AND BASEBAND CIRCUIT | |||||||||||||||||||||||||||||||||||||||||
| MC34VR500VAES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | 15mA | QorlQ LS1/T1 Communications Processors | 2.8V~4.5V | |||||||||||||||||||||||||||||||||||
| MC33FS8430G0ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||||
| MC35FS4500CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS4502CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS6503NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC35FS6500CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 14 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33PF8200DHESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||
| MC33FS6511CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC35FS6511CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33PF8200DBESR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 2 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 56-VFQFN Exposed Pad | Surface Mount, Wettable Flank | -40°C~105°C TA | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | 2.5V~5.5V | ||||||||||||||||||||||||||||||||||||
| MC33FS8510A3ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||||
| MC34PF3000A4EPR2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | 2014 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | ALSO REQUIRE SUPPLY VOLTAGE 3.7V TO 5.5V | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~105°C | MOS | 0.9mm | 8542.39.00.01 | 1 | QUAD | NO LEAD | 260 | 3.6V | NOT SPECIFIED | YES | 0.5mm | S-XQCC-N48 | 2.8V | 12 | 4.5V | POWER SUPPLY SUPPORT CIRCUIT | i.MX Processors | YES | 2.8V~5.5V | |||||||||||||
| MC33FS8430G4ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| MC35FS6512CAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC35FS6502NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33PF8100EPES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Tray | Active | 3 (168 Hours) | 56 | 8mm | 56-VFQFN Exposed Pad | 8mm | Surface Mount, Wettable Flank | -40°C~105°C TA | 1mm | 1 | QUAD | NO LEAD | 5V | YES | 0.5mm | S-PQCC-N56 | 2.7V | 12 | 5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | YES | 2.7V~5.5V | |||||||||||||||||||||
| MC35FS6510CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 15 Weeks | Tray | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~150°C TA | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS6512CAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 16 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS6522NAE | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tray | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33FS6502NAER2 | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 17 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 48-LQFP Exposed Pad | Surface Mount | -40°C~125°C | 260 | 40 | System Basis Chip | INTERFACE CIRCUIT | 1V~5V | ||||||||||||||||||||||||||||||||
| MC33PF8100EQES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 8 Weeks | Tray | Active | 3 (168 Hours) | 56 | 8mm | 56-VFQFN Exposed Pad | 8mm | Surface Mount, Wettable Flank | -40°C~105°C TA | 1mm | 1 | QUAD | NO LEAD | 5V | YES | 0.5mm | S-PQCC-N56 | 2.7V | 12 | 5.5V | POWER SUPPLY MANAGEMENT CIRCUIT | High Performance i.MX 8, S32x Processor Based | YES | 2.7V~5.5V | |||||||||||||||||||||
| MC33FS8530A4ES | NXP USA Inc. | $0.00 |
Min: 1 Mult: 1 |
2 Weeks | Tray | Active | 3 (168 Hours) |