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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O
416
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
391
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
991
484-BGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/OMin 1.14V VMax 1.26V V
795
400-LFBGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
980
400-LFBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
794
256-LBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S025T System On ChipSmartFusion?2 Series 207 I/O
738
400-LFBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
261
256-LFBGA
Microsemi Corporation
0°C~85°C TJ M2S025T System On ChipSmartFusion?2 Series 267 I/O
463
484-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
937
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
808
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
525
484-BGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/OMin 1.14V VMax 1.26V V
159
400-LFBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
417
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
128
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ 325 Pin System On ChipSmartFusion?2 Series 200 I/O1.2V
445
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ 484 Pin M2S025 System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
548
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
748
325-TFBGA, CSPBGA
Microsemi Corporation
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
632
400-LFBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S050 System On ChipSmartFusion?2 Series 207 I/O
281
400-LFBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
413
325-TFBGA, CSPBGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
696
325-TFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S010 System On ChipSmartFusion?2 Series 195 I/O
491
400-LFBGA
Microsemi Corporation
-40°C~100°C TJ M2S005 System On ChipSmartFusion?2 Series 209 I/O
237
484-BGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
720
256-LFBGA
Microsemi Corporation
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 209 I/O
440
484-BGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
642
256-LBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S010T System On ChipSmartFusion?2 Series 195 I/O
177
400-LFBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O1.5V
827
256-LBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
451
256-LFBGA