Products
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V
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273 |
256-LFBGA |
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Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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539 |
144-LQFP |
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Microsemi Corporation |
0°C~85°C TJ 484 Pin M2S005 System On ChipSmartFusion?2 Series 209 I/O
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509 |
484-BGA |
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Intel |
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 288 I/O0.9V
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552 |
780-BBGA, FCBGA |
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Microsemi Corporation |
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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298 |
144-LQFP |
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Microsemi Corporation |
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 209 I/O1.2V
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700 |
484-BGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 209 I/O1.2V
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395 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/O
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199 |
400-LFBGA |
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Xilinx Inc. |
400 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 125 I/O1V
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782 |
400-LFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V
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990 |
256-LFBGA |
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Microsemi Corporation |
208 Terminations-40°C~100°C TJ 208 Pin A2F200 System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V
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732 |
208-BFQFP |
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GHI Electronics, LLC |
-40°C~85°C System On Chip78 I/O
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919 |
100-LQFP |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O
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377 |
900-BBGA, FCBGA |
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Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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689 |
144-LQFP |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 169 I/O1.2V
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591 |
400-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S010 System On ChipSmartFusion?2 Series 195 I/O
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788 |
400-LFBGA |
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ON Semiconductor |
System On Chip
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268 |
- |
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Microsemi Corporation |
-40°C~100°C TJ M2S005S System On ChipSmartFusion?2 Series 209 I/O
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680 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 209 I/O
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603 |
484-BGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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267 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V
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729 |
256-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ 484 Pin M2S050T System On ChipSmartFusion?2 Series 267 I/O
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244 |
484-BGA |
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Xilinx Inc. |
484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 200 I/O1V
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938 |
484-LFBGA, CSPBGA |
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Xilinx Inc. |
900 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V
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885 |
900-BBGA, FCBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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491 |
484-BGA |
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Intel |
672 Terminations-40°C~100°C TJ System On ChipCyclone? V SE Series MCU - 181, FPGA - 145 I/O1.1V
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805 |
672-FBGA |
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Intel |
896 Terminations0°C~85°C TJ 5CSXFC5 System On ChipCyclone? V SX Series MCU - 181, FPGA - 288 I/O1.1V
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274 |
896-BGA |
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Intel |
672 Terminations0°C~85°C TJ 5CSEBA6 System On ChipCyclone? V SE Series MCU - 181, FPGA - 145 I/O1.1V
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534 |
672-FBGA |
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Intel |
896 Terminations0°C~85°C TJ 5CSXFC6 System On ChipCyclone? V SX Series MCU - 181, FPGA - 288 I/O1.1V
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832 |
896-BGA |
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Xilinx Inc. |
484 Terminations0°C~100°C TJ 484 Pin XC7Z020 System On ChipZynq?-7000 Series 130 I/O1V
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725 |
484-LFBGA, CSPBGA |
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Products