Products
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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136 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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906 |
256-LFBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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199 |
256-LBGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S025 System On ChipSmartFusion?2 Series 207 I/O
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167 |
400-LFBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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136 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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365 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
0°C~85°C TJ M2S010T System On ChipSmartFusion?2 Series 233 I/O
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647 |
484-BGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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919 |
256-LFBGA |
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Microsemi Corporation |
-40°C~100°C TJ M2S025 System On ChipSmartFusion?2 Series 267 I/O
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189 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ 484 Pin M2S050 System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
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464 |
484-BGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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217 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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189 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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103 |
256-LBGA |
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Microsemi Corporation |
400 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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658 |
400-LFBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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550 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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738 |
256-LFBGA |
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Xilinx Inc. |
225 Terminations0°C~100°C TJ 225 Pin XC7Z010 System On ChipZynq?-7000 Series 86 I/O1V
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657 |
225-LFBGA, CSPBGA |
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Xilinx Inc. |
484 Terminations-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
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338 |
484-BBGA, FCBGA |
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Microsemi Corporation |
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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563 |
144-LQFP |
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Microsemi Corporation |
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
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417 |
144-LQFP |
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Microsemi Corporation |
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O
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162 |
256-LBGA |
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Intel |
-40°C~100°C TJ System On ChipStratix? 10 SX Series
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758 |
1760-BBGA, FCBGA |
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Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O
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580 |
144-LQFP |
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Microsemi Corporation |
0°C~85°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V
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101 |
256-LBGA |
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Microsemi Corporation |
-40°C~100°C TJ System On ChipSmartFusion?2 Series 425 I/O
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867 |
676-BGA |
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Intel |
-40°C~100°C TJ System On ChipStratix? 10 SX Series
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148 |
2397-BBGA, FCBGA |
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Broadcom Limited |
System On Chip
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197 |
- |
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Broadcom Limited |
System On Chip
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259 |
- |
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Broadcom Limited |
System On Chip
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205 |
- |
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Microsemi Corporation |
-40°C~100°C TJ 484 Pin M2S050S System On ChipSmartFusion?2 Series 267 I/OMin 1.14V VMax 1.26V V
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995 |
484-BGA |
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Products