All Products

SoC

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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Xilinx Inc.
900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V
468
900-BBGA, FCBGA
Xilinx Inc.
900 Terminations-40°C~100°C TJ XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V
367
900-BBGA, FCBGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O
119
676-BBGA, FCBGA
Xilinx Inc.
900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O
234
900-BBGA, FCBGA
Xilinx Inc.
784 TerminationsSystem On Chip0.85V
540
-
Xilinx Inc.
900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V
882
900-BBGA, FCBGA
Xilinx Inc.
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O
325
900-BBGA, FCBGA
Intel
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 288 I/O0.9V
210
780-BBGA, FCBGA
iBASE Technology
System On Chip
164
-
Intel
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V
119
780-BBGA, FCBGA
iBASE Technology
System On Chip
589
-
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
941
325-TFBGA, CSPBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
227
256-LFBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S010 System On ChipSmartFusion?2 Series 195 I/O
344
400-LFBGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S010TS System On ChipSmartFusion?2 Series 195 I/O
901
400-LFBGA
Microsemi Corporation
288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V
530
288-TFBGA, CSPBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
158
256-LBGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
261
325-TFBGA, CSPBGA
Microsemi Corporation
208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V
294
208-BFQFP
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
287
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ 484 Pin M2S010T System On ChipSmartFusion?2 Series 233 I/O
405
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
995
325-TFBGA, CSPBGA
Microsemi Corporation
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 233 I/O
605
484-BGA
Microsemi Corporation
-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O
416
484-BGA
Microsemi Corporation
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
391
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
991
484-BGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/OMin 1.14V VMax 1.26V V
795
400-LFBGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
980
400-LFBGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
794
256-LBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S025T System On ChipSmartFusion?2 Series 207 I/O
738
400-LFBGA