Products
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Xilinx Inc. |
900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V
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468 |
900-BBGA, FCBGA |
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Xilinx Inc. |
900 Terminations-40°C~100°C TJ XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V
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367 |
900-BBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O
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119 |
676-BBGA, FCBGA |
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Xilinx Inc. |
900 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O
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234 |
900-BBGA, FCBGA |
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Xilinx Inc. |
784 TerminationsSystem On Chip0.85V
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540 |
- |
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Xilinx Inc. |
900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V
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882 |
900-BBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O
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325 |
900-BBGA, FCBGA |
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Intel |
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 288 I/O0.9V
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210 |
780-BBGA, FCBGA |
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iBASE Technology |
System On Chip
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164 |
- |
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Intel |
780 Terminations0°C~100°C TJ System On ChipArria 10 SX Series 360 I/O0.9V
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119 |
780-BBGA, FCBGA |
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iBASE Technology |
System On Chip
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589 |
- |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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941 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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227 |
256-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S010 System On ChipSmartFusion?2 Series 195 I/O
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344 |
400-LFBGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S010TS System On ChipSmartFusion?2 Series 195 I/O
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901 |
400-LFBGA |
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Microsemi Corporation |
288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V
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530 |
288-TFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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158 |
256-LBGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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261 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
208 Terminations0°C~85°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/O1.5V Min 1.425V VMax 1.575V V
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294 |
208-BFQFP |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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287 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
-40°C~100°C TJ 484 Pin M2S010T System On ChipSmartFusion?2 Series 233 I/O
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405 |
484-BGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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995 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 233 I/O
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605 |
484-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/O
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416 |
484-BGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V
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391 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
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991 |
484-BGA |
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Microsemi Corporation |
-40°C~100°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/OMin 1.14V VMax 1.26V V
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795 |
400-LFBGA |
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Microsemi Corporation |
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
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980 |
400-LFBGA |
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Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
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794 |
256-LBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S025T System On ChipSmartFusion?2 Series 207 I/O
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738 |
400-LFBGA |
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Products