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Part Number
Manufacturers
Desc
In Stock
Packing
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Xilinx Inc.
900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V
208
900-BBGA, FCBGA
Xilinx Inc.
900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.72V
671
900-BBGA, FCBGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
476
400-LFBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V
239
484-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
663
484-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
700
484-BGA
Xilinx Inc.
400 Terminations0°C~100°C TJ 400 Pin XC7Z020 System On ChipZynq?-7000 Series 130 I/O1V
381
400-LFBGA, CSPBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ M2S090 System On ChipSmartFusion?2 Series 425 I/O1.2V
525
676-BGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V
379
400-LFBGA
Microsemi Corporation
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 387 I/O
612
676-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
366
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
102
484-BGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V
724
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ M2S090 System On ChipSmartFusion?2 Series 267 I/O1.2V
819
484-BGA
Microsemi Corporation
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
521
325-TFBGA, CSPBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
737
484-BFBGA
Xilinx Inc.
400 Terminations-40°C~100°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
347
400-LFBGA, CSPBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
866
484-BGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
141
484-BGA
Microsemi Corporation
0°C~85°C TJ M2S150 System On ChipSmartFusion?2 Series 574 I/O1.2V
678
1152-BBGA, FCBGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
503
484-BFBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
768
484-BGA
Microsemi Corporation
536 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 293 I/O1.2V
692
536-LFBGA, CSPBGA
Microsemi Corporation
676 Terminations-40°C~100°C TJ 676 Pin M2S090TS System On ChipSmartFusion?2 Series 425 I/O1.2V
413
676-BGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
594
484-BFBGA
Microsemi Corporation
676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V
862
676-BGA
Microsemi Corporation
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
246
484-BFBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 273 I/O1.2V
212
484-BFBGA
Microsemi Corporation
0°C~85°C TJ M2S150T System On ChipSmartFusion?2 Series 574 I/O1.2V
779
1152-BBGA, FCBGA
Microsemi Corporation
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
875
484-BGA